Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
Precio habitual
$18.59 USD
Precio habitual
Precio de oferta
$18.59 USD
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3 reviews
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Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
Reballing BGA chips can be tricky—this magnetic silicone mat keeps stencils and chips perfectly aligned while you work, for cleaner, faster repairs.
- Magnetic hold: Firmly secures steel stencils and chips to prevent shifting.
- Universal fit: Works with most mobile phone CPUs, GPUs, and other BGA ICs.
- Heat-resistant silicone: Designed to withstand soldering temperatures.
- Precision planting: Ideal for planting solder balls on IC chips before reflow.
- Durable & reusable: Built for tough workshop conditions and repeated use.
Get consistent repairs every time—add this magnetic stencil mat to your toolkit today.
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- 5 stars: 3 (100%)
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AliExpress Shopper shipped fast. quality on top. chips are lays perfect
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AliExpress Shopper O produto veio bem embalado e super rápido, é é de uma qualidade excelente. Tem imãs atrás para o componente não ficar escapando no reballing.
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AliExpress Shopper The mag grid is of higher quality. arrived ahead of schedule, I recommend this seller