Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
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Magnetic BGA Reballing Stencil Mat for Phone CPU IC Repair
Reballing BGA chips can be tricky—this magnetic silicone mat keeps stencils and chips perfectly aligned while you work, for cleaner, faster repairs.
- Magnetic hold: Firmly secures steel stencils and chips to prevent shifting.
- Universal fit: Works with most mobile phone CPUs, GPUs, and other BGA ICs.
- Heat-resistant silicone: Designed to withstand soldering temperatures.
- Precision planting: Ideal for planting solder balls on IC chips before reflow.
- Durable & reusable: Built for tough workshop conditions and repeated use.
Get consistent repairs every time—add this magnetic stencil mat to your toolkit today.
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- 5 stars: 6 (100%)
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arrive very fast and is expected to my liking
arrive very fast and is expected to my liking
shipped fast. quality on top. chips are lays perfect
shipped fast. quality on top. chips are lays perfect
The mag grid is of higher quality. arrived ahead of schedule, I recommend this seller
The mag grid is of higher quality. arrived ahead of schedule, I recommend this seller