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BGA Stencil for Reballing - 0.3/0.35/0.4/0.5mm & 45° Hole

BGA Stencil for Reballing - 0.3/0.35/0.4/0.5mm & 45° Hole

$19.04 USD
$19.04 USD
Sale Sold out
Shipping calculated at checkout.

Repair smartphones, laptops, and circuit boards with confidence using this professional BGA reballing stencil. Precision-engineered for accurate solder paste application on chips with 0.3/0.35/0.4/0.5mm pad sizes and 45° angled holes.

  • Multi-purpose compatibility – works with common BGA chips for phone, laptop, and PCB rework.
  • Precision-designed holes ensure clean, uniform solder balls for reliable connections.
  • Durable metal construction withstands repeated use and high temperatures.
  • Includes multiple stencil patterns for 0.3, 0.35, 0.4, 0.5, parallel, and 45° hole configurations.
  • Compact and lightweight – easy to handle, clean, and store.

Upgrade your soldering toolkit with a reliable BGA stencil designed for accuracy and long-lasting performance.

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  • 5 stars: 6 (100%)
  • 4 stars: 0 (0%)
  • 3 stars: 0 (0%)
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  • 1 star: 0 (0%)
H
H***n

It took 2 weeks to ship to Bulgaria and came packed in bubble wrap. The stencil is of great quality and comes with a variety of BGA configurations and sizes.

H***n review photo H***n review photo
B
B***H

It arrived safely and I’m very happy for this item

B***H review photo B***H review photo
v
v***r

The order was fulfilled quickly and accurately. Very well packed. Thank you!

v
v***r

The order was fulfilled quickly and accurately. Very well packed. Thank you!

H
H***n

It took 2 weeks to ship to Bulgaria and came packed in bubble wrap. The stencil is of great quality and comes with a variety of BGA configurations and sizes.

B
B***H

It arrived safely and I’m very happy for this item